Multi-Chip Module Test Strategies

Edited by Zorian, Yervant

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

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  • Foreword
  • V.D. Agrawal. MCM Testing Background: Fundamentals of MCM Testing and Design-For-Testability
  • Y. Zorian. Die Level Testing: Known Good Die
  • L. Gilg. Substrate Testing: A Survey of Test Techniques for MCM Substrates
  • M. Swaminathan, et al. Smart Substrate MCMs
  • A. Gattiker, W. Maly. Electron Beam Probing - A Solution for MCM Test and Failure Analysis
  • R. Schmid, et al. Module Level Test: MCM Test Strategy Synthesis from Chip Test and Board Test Approaches
  • A. Flint. Designing 'Dual Personality' IEEE 1149.1 Compliant Multi-Chip Modules
  • N. Jarwala. An Effective Multi-Chip BIST Scheme
  • Y. Zorian, H. Bederr. MCM Test Applications: Design-For-Test in a Multiple Substrate Multichip Module
  • J.A. Jorgenson, R.J. Wagner. A Test Methodology for High Performance MCMs
  • T.M. Storey, B. McWilliam. Module Level Diagnosis: A Formalization of the IEEE 1149.1-1990 Diagnostic Methodology as Applied to Multichip Modules
  • K. Posse. Multichip Module Diagnosis by Product-Code Signatures
  • P. Nagvajara, et al. Simulation Techniques for MCMs: Simulation Techniques for the Manufacturing Test of MCMs
  • M. Tegethoff, T. Chen. MCM Test Economics: Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die
  • C.F. Murphy, et al. Index.

「Nielsen BookData」より


書名 Multi-Chip Module Test Strategies
著作者等 Zorian, Yervant
シリーズ名 Frontiers in Electronic Testing 7
出版元 Springer-Verlag New York Inc.
刊行年月 2012.10.04
版表示 Softcover reprint of the original 1st ed. 1997
ページ数 167p
大きさ H260 x W195
ISBN 9781461377986
言語 英語
出版国 アメリカ合衆国